Vacuum Outgassing

Cleanpart service sites are equipped with vaccum ovens that are in charge to outgas efficiently the semiconductor parts after their cleaning and rinsing steps. Moisture is a strong detractor in most semiconductor manufacturing processes so it is critical to include such technologies in our process flow.

Benefits

Cleanpart runs dedicated vacuum chambers with different dimensions for the degassing of small- to large-sized parts or to treat high volumes. The process is mainly used as a posttreatment for already cleaned parts or/and as a pretreatment for parts that have to be used under vacuum conditions. The advantages are:

  • Efficient elimination of moisture (H₂O) as well as the removal of material of lower volatility (organic products)
  • Reduction of pump-down times if parts are used under vacuum condition (such as etch or deposition processes)
  • Therefore, increased equipment availability

Properties

The parameters for treatment capabilities and procedures are:

  • Chamber dimensions: up to 1.5 x 1.5 x 1.5 m
  • Vacuum level down to 0.13 Pa
  • Oven temperature up to 500°K
  • Ramp-up/ramp-down profiles
  • Inert gas flow

Vacuum outgassing describes the process of placing components in a recipient (vacuum chamber). Usually, the chamber is heated and purged with N₂ or noble gases to carry off the extracted material.

The double effect of heat and vacuum will allow a very efficient drying of components, especially those with porous surfaces (coated parts) or porous bulk material (ceramics and graphite). Additionally, organic material is removed. The process is more expensive but superior compared to normal oven baking.

As a consequence, emphasis has to be placed on appropriate and thorough packaging to avoid reabsorption of moisture or materials of any kind.